Thermaltake TG-30 heat sink compound Thermal paste 4.5 W/m·K

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

High Thermal Conductivity
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.

Easy to Apply
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.

All-In-One Application Kit
This thermal compound application kit includes a set of easily-applied tools for immediate use.

Sustainability and Safety
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.